2026-03-12 17:20:23
Wafer processing: The main task of this process is to fabricate circuits and electronic components (such as transistors, capacitors, logic switches, etc.) on the wafer. The processing procedure is usually related to the type of product and the technology used, but the basic steps are to first clean the wafer appropriately, then oxidize and chemically vapor deposit it on the surface, and then perform repeated steps such as coating, exposure, development, etching, ion implantation, metal sputtering, etc. Finally, several layers of circuits and components are processed and fabricated on the wafer.
The size of wafers is generally divided into:4-inch, 6-inch , 8-inch,12-inch.
To protect the wafer from scratches, we need to use a wafer mounter machine.
Our Wafer mounter machine has replaced the chuck with a black anti-static tray, and the height of the chuck can be adjusted to accommodate wafers with a thickness of 150-700Um.
Manual wafer laminating machine, Semi-automatic wafer laminator machine, Fully automatic wafer laminating machine.
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