2026-07-15 17:16:07
In the backside thinning process of a wafer, the thin film attached to the front side of the wafer (including the active device and microstructure side) is called a backside thinning tape (BG Tape or thin film in the industry)
Its core function is to protect the integrated circuits and micro bumps on the front side of the wafer from physical scratches, contamination by grinding fluid and silicon powder particles during high mechanical stress grinding processes, while buffering mechanical stress and assisting in controlling the total thickness deviation (TTV) of the wafer.
1, （UV-Curable / UV Release）
|
Advantages |
Shortcoming |
|
Viscosity controllable (strong to weak switching) |
UV irradiation equipment is required |
|
Low stripping force, protecting fragile chips |
relatively high cost |
|
Less residual glue and high cleanliness |
UV may affect certain photosensitive devices |
Applicable to:
Convex wafers, ultra-thin wafers, vulnerable devices, and high cleanliness requirements.
|
Advantage |
Shortcoming |
|
Peel off thoroughly and cleanly |
Heating is required, which may affect the thermistor |
|
Can automatically detach the entire surface |
High temperature control requirements |
|
Suitable for automation |
Heating may introduce thermal stress |
Applicable to:
In situations where temporary bonding is required, the entire surface needs to be peeled off, and UV cannot be used.
3,（Pressure Sensitive / Non-release）
|
Advantages |
Shortcoming |
|
Lowest cost |
Fixed peeling force, non adjustable |
|
No additional equipment required (UV/heating) |
High stress during peeling |
|
Simple process |
Possible residual glue, average cleanliness |
Applicable to:
Ordinary thick wafers, cost sensitive, and insensitive to peel stress.
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uvcure@uvspacelight.com
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